XC7Z100-1FFG900I

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Mfr.Part #
XC7Z100-1FFG900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 667MHZ 900FCBGA
Stock
980
In Stock :
980

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Frequency :
667MHz
RoHS Status :
ROHS3 Compliant
Base Part Number :
XC7Z100
Peripherals :
DMA
Length :
31mm
Architecture :
MCU, FPGA
Series :
Zynq®-7000
Peak Reflow Temperature (Cel) :
245
Supply Voltage-Min (Vsup) :
0.95V
Radiation Hardening :
No
Supply Voltage-Max (Vsup) :
1.05V
Operating Temperature :
-40°C~100°C TJ
Terminal Position :
BOTTOM
Primary Attributes :
Kintex™-7 FPGA, 444K Logic Cells
Factory Lead Time :
10 Weeks
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Terminal Pitch :
1mm
JESD-609 Code :
e1
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ECCN Code :
3A991.D
Published :
2010
Packaging :
Tube
RAM (words) :
256000
Number of Terminations :
900
Core Architecture :
ARM
Supply Voltage :
1V
HTS Code :
8542.39.00.01
RAM Size :
256KB
Bus Compatibility :
CAN; ETHERNET; I2C; SPI; UART; USB
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Boundary Scan :
yes
Surface Mount :
yes
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
JESD-30 Code :
S-PBGA-B900
Height Seated (Max) :
3.35mm
Width :
31mm
Terminal Form :
Ball
Number of I/O :
212
Package / Case :
900-BBGA, FCBGA
Datasheets
XC7Z100-1FFG900I
Introducing System On Chip (SoC) AMD Xilinx XC7Z100-1FFG900I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC7Z100, Operating Temperature:-40°C~100°C TJ, Number of Terminations:900, Package / Case:900-BBGA, FCBGA, XC7Z100-1FFG900I pinout, XC7Z100-1FFG900I datasheet PDF, XC7Z100-1FFG900I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z100-1FFG900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z100-1FFG900I


900 Terminations -40°C~100°C TJ XC7Z100 System On Chip Zynq®-7000 Series 212 I/O 1V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 444K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tube package, this SoC system on a chip provides outstanding performance.212 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.If it has at least a 0.95V volt power supply, it can work fine.In total, there are 900 terminations, so system on a chip is really aided by this.A search for XC7Z100 will result in system on chips that have similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z100-1FFG900I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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