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    Mfr.Part #
    XC7Z100-1FF900I
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 667MHZ 900FCBGA
    Stock
    19,881
    In Stock ：
    19,881

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    RoHS Status :
    Non-RoHS Compliant
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Number of I/O :
    130
    Operating Temperature :
    -40°C~100°C TJ
    Data Bus Width :
    32b
    Max Frequency :
    667MHz
    Frequency :
    667MHz
    Primary Attributes :
    Kintex™-7 FPGA, 444K Logic Cells
    Architecture :
    MCU, FPGA
    Speed :
    667MHz
    Supplier Device Package :
    900-FCBGA (31x31)
    Package / Case :
    900-BBGA, FCBGA
    Core Architecture :
    ARM
    Published :
    2010
    Factory Lead Time :
    10 Weeks
    Max Operating Temperature :
    100°C
    Packaging :
    Tray
    Min Operating Temperature :
    -40°C
    RAM Size :
    256KB
    Series :
    Zynq®-7000
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Peripherals :
    DMA
    Datasheets
    XC7Z100-1FF900I
    Introducing System On Chip (SoC) AMD Xilinx XC7Z100-1FF900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XC7Z100-1FF900I pinout, XC7Z100-1FF900I datasheet PDF, XC7Z100-1FF900I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z100-1FF900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z100-1FF900I


    -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq®-7000.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Kintex™-7 FPGA, 444K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.wireless SoCs operate at 667MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z100-1FF900I System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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