XC7Z045-L2FFG900I
- Mfr.Part #
- XC7Z045-L2FFG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 16,985
- In Stock :
- 16,985
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supply Voltage-Min (Vsup) :
- 0.95V
- Width :
- 31mm
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Number of I/O :
- 130
- Core Architecture :
- ARM
- Supply Voltage :
- 1V
- Operating Temperature :
- -40°C~100°C TJ
- Peripherals :
- DMA
- ECCN Code :
- 3A991.D
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Number of Terminations :
- 900
- Published :
- 2010
- Packaging :
- Tray
- Height Seated (Max) :
- 3.35mm
- Boundary Scan :
- yes
- Surface Mount :
- yes
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Frequency :
- 800MHz
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Package / Case :
- 900-BBGA, FCBGA
- JESD-30 Code :
- S-PBGA-B900
- Supply Voltage-Max (Vsup) :
- 1.05V
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- RAM Size :
- 256KB
- Series :
- Zynq®-7000
- Terminal Pitch :
- 1mm
- RAM (words) :
- 256000
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- JESD-609 Code :
- e1
- Architecture :
- MCU, FPGA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 245
- Terminal Form :
- Ball
- Length :
- 31mm
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XC7Z045-L2FFG900I

900 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.In order to run it, it must be fed by at least 0.95V of power.The system on a chip uses 900 terminations in total.A wireless SoC that operates at a frequency of 800MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z045-L2FFG900I System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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