XC7Z045-L2FFG676I
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- Mfr.Part #
- XC7Z045-L2FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 31,868
- In Stock ：
- 31,868
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Operating Temperature :
- -40°C~100°C TJ
- RAM (words) :
- 256000
- JESD-609 Code :
- e1
- Core Architecture :
- ARM
- Max Supply Voltage :
- 1.05V
- Series :
- Zynq®-7000
- Mount :
- Surface Mount
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Published :
- 2010
- RAM Size :
- 256KB
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Terminal Position :
- BOTTOM
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 130
- HTS Code :
- 8542.39.00.01
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 27mm
- Architecture :
- MCU, FPGA
- Min Supply Voltage :
- 950mV
- Packaging :
- Tray
- Height Seated (Max) :
- 3.37mm
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Frequency :
- 800MHz
- Terminal Pitch :
- 1mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Registers :
- 437200
- Peripherals :
- DMA
- Supply Voltage :
- 1V
- Propagation Delay :
- 100 ps
- JESD-30 Code :
- S-PBGA-B676
- Contact Plating :
- Copper, Silver, Tin
- Factory Lead Time :
- 10 Weeks
- Boundary Scan :
- yes
- Length :
- 27mm
- Number of Terminations :
- 676
- Terminal Form :
- Ball
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Datasheets
- XC7Z045-L2FFG676I
676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 350K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In total, there are 676 terminations, which is great for system on a chip.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This power supply is rated with a maximum voltage of 1.05V.Power is supplied to it at least in the amount of 950mV.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z045-L2FFG676I System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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