XC7Z045-L2FBG676I
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- Mfr.Part #
- XC7Z045-L2FBG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 12,288
- In Stock ：
- 12,288
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Package / Case :
- 676-BBGA, FCBGA
- Supply Voltage :
- 1V
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code :
- 8542.39.00.01
- Boundary Scan :
- yes
- Width :
- 27mm
- Published :
- 2010
- Frequency :
- 800MHz
- Core Architecture :
- ARM
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Series :
- Zynq®-7000
- RoHS Status :
- ROHS3 Compliant
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- RAM Size :
- 256KB
- Terminal Form :
- Ball
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Supply Voltage-Max (Vsup) :
- 1.05V
- JESD-609 Code :
- e1
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~100°C TJ
- Architecture :
- MCU, FPGA
- Terminal Pitch :
- 1mm
- Peripherals :
- DMA
- Packaging :
- Tray
- Height Seated (Max) :
- 2.54mm
- JESD-30 Code :
- S-PBGA-B676
- Supply Voltage-Min (Vsup) :
- 0.95V
- Length :
- 27mm
- ECCN Code :
- 3A991.D
- Number of I/O :
- 130
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Factory Lead Time :
- 10 Weeks
- Number of Terminations :
- 676
- RAM (words) :
- 256000
- Datasheets
- XC7Z045-L2FBG676I
676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Kintex™-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.Power supply should be at least 0.95V.It is really beneficial to have system on a chip since there are 676 terminations in total.There is 800MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z045-L2FBG676I System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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