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XC7Z045-3FFV676E

XC7Z045-3FFV676E

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Mfr.Part #
XC7Z045-3FFV676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 1GHZ 676FCBGA
Stock
48,702
In Stock ：
48,702

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peripherals :
DMA
Operating Temperature :
0°C~100°C TJ
Package / Case :
676-BBGA, FCBGA
Architecture :
MCU, FPGA
Published :
2009
Speed :
1GHz
Series :
Zynq®-7000
Number of I/O :
130
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size :
256KB
Factory Lead Time :
10 Weeks
Primary Attributes :
Kintex™-7 FPGA, 350K Logic Cells
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Packaging :
Bulk
RoHS Status :
ROHS3 Compliant
Datasheets
XC7Z045-3FFV676E
Introducing System On Chip (SoC) AMD Xilinx XC7Z045-3FFV676E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：676-BBGA, FCBGA, XC7Z045-3FFV676E pinout, XC7Z045-3FFV676E datasheet PDF, XC7Z045-3FFV676E amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z045-3FFV676E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Kintex™-7 FPGA, 350K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Bulk package.This SoC part contains a total of 130 I/Os in total.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XC7Z045-3FFV676E System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
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