XC7Z045-3FFG676E
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- Mfr.Part #
- XC7Z045-3FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 1GHZ 676FCBGA
- Stock
- 49,239
- In Stock ：
- 49,239
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- 3A991.D
- RAM (words) :
- 256000
- Operating Temperature :
- 0°C~100°C TJ
- RAM Size :
- 256KB
- Frequency :
- 1GHz
- Published :
- 2009
- Terminal Form :
- Ball
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Speed Grade :
- -3
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Peripherals :
- DMA
- JESD-609 Code :
- e1
- JESD-30 Code :
- S-PBGA-B676
- Factory Lead Time :
- 10 Weeks
- Series :
- Zynq®-7000
- Supply Voltage-Max (Vsup) :
- 1.05V
- Operating Supply Voltage :
- 1V
- Core Architecture :
- ARM
- Base Part Number :
- XC7Z045
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max) :
- 3.37mm
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- Length :
- 27mm
- Surface Mount :
- yes
- Supply Voltage :
- 1V
- Package / Case :
- 676-BBGA, FCBGA
- Memory Type :
- ROMless
- Terminal Pitch :
- 1mm
- Data Bus Width :
- 32b
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of Terminations :
- 676
- HTS Code :
- 8542.39.00.01
- Radiation Hardening :
- No
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 245
- Boundary Scan :
- yes
- Contact Plating :
- Copper, Silver, Tin
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Architecture :
- MCU, FPGA
- Number of I/O :
- 130
- Datasheets
- XC7Z045-3FFG676E
676 Terminations 0°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Kintex™-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.It is really beneficial to have system on a chip since there are 676 terminations in total.By searching XC7Z045, you can find system on chips with similar specs and purposes.There is 1GHz frequency associated with the wireless SoC.It uses ARM as its core architecture.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG676E System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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