XC7Z045-2FFG900E
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- Mfr.Part #
- XC7Z045-2FFG900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 31,004
- In Stock ：
- 31,004
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Architecture :
- MCU, FPGA
- Published :
- 2009
- JESD-609 Code :
- e1
- Contact Plating :
- Copper, Silver, Tin
- Length :
- 31mm
- Operating Supply Voltage :
- 1V
- Peripherals :
- DMA
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Supply Voltage-Max (Vsup) :
- 1.05V
- Operating Temperature :
- 0°C~100°C TJ
- HTS Code :
- 8542.39.00.01
- Speed Grade :
- -2
- Package / Case :
- 900-BBGA, FCBGA
- Data Bus Width :
- 32b
- ECCN Code :
- 3A991.D
- Core Architecture :
- ARM
- RoHS Status :
- ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Memory Type :
- ROMless
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max) :
- 3.35mm
- Terminal Form :
- Ball
- Base Part Number :
- XC7Z045
- RAM (words) :
- 256000
- Frequency :
- 800MHz
- Surface Mount :
- yes
- Boundary Scan :
- yes
- Number of Terminations :
- 900
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Series :
- Zynq®-7000
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- RAM Size :
- 256KB
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Supply Voltage :
- 1V
- Radiation Hardening :
- No
- Peak Reflow Temperature (Cel) :
- 245
- Number of I/O :
- 130
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B900
- Datasheets
- XC7Z045-2FFG900E
900 Terminations 0°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Kintex™-7 FPGA, 350K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a result, there are 900 terminations in total, which does really benefit system on a chip.XC7Z045 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900E System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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