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    Mfr.Part #
    XC7Z045-2FF676I
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 800MHZ 676FCBGA
    Stock
    16,371
    In Stock ：
    16,371

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Boundary Scan :
    yes
    Terminal Form :
    Ball
    Peripherals :
    DMA
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Published :
    2010
    RAM (words) :
    256000
    Primary Attributes :
    Kintex™-7 FPGA, 350K Logic Cells
    Terminal Position :
    BOTTOM
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Surface Mount :
    yes
    Factory Lead Time :
    10 Weeks
    Number of Terminations :
    676
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Frequency :
    800MHz
    Package / Case :
    676-BBGA, FCBGA
    Pbfree Code :
    No
    Number of I/O :
    130
    RAM Size :
    256KB
    Packaging :
    Tray
    RoHS Status :
    Non-RoHS Compliant
    Core Architecture :
    ARM
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Operating Temperature :
    -40°C~100°C TJ
    Bus Compatibility :
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
    Memory Type :
    ROMless
    Architecture :
    MCU, FPGA
    Series :
    Zynq®-7000
    Data Bus Width :
    32b
    JESD-30 Code :
    S-PBGA-B676
    HTS Code :
    8542.39.00.01
    Datasheets
    XC7Z045-2FF676I
    Introducing System On Chip (SoC) AMD Xilinx XC7Z045-2FF676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations：676, Package / Case：676-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XC7Z045-2FF676I pinout, XC7Z045-2FF676I datasheet PDF, XC7Z045-2FF676I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z045-2FF676I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z045-2FF676I


    676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.A system on a chip benefits from having 676 terminations.At 800MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z045-2FF676I System On Chip (SoC) applications.


    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
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