XC7Z045-2FBG676I
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- Mfr.Part #
- XC7Z045-2FBG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 39,269
- In Stock ：
- 39,269
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Length :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Radiation Hardening :
- No
- Operating Supply Voltage :
- 1V
- JESD-609 Code :
- e1
- Number of Terminations :
- 676
- RoHS Status :
- ROHS3 Compliant
- Boundary Scan :
- yes
- Number of I/O :
- 130
- Core Architecture :
- ARM
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Height Seated (Max) :
- 2.54mm
- RAM (words) :
- 256000
- Supply Voltage-Max (Vsup) :
- 1.05V
- HTS Code :
- 8542.39.00.01
- Surface Mount :
- yes
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Number of Pins :
- 676
- Peak Reflow Temperature (Cel) :
- 245
- RAM Size :
- 256KB
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Supply Voltage :
- 1V
- Peripherals :
- DMA
- Contact Plating :
- Copper, Silver, Tin
- Series :
- Zynq®-7000
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Frequency :
- 800MHz
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Published :
- 2009
- Memory Type :
- ROMless
- Architecture :
- MCU, FPGA
- Factory Lead Time :
- 10 Weeks
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Data Bus Width :
- 32b
- Package / Case :
- 676-BBGA, FCBGA
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- ECCN Code :
- 3A991.D
- Base Part Number :
- XC7Z045
- Operating Temperature :
- -40°C~100°C TJ
- Speed Grade :
- -2
- Datasheets
- XC7Z045-2FBG676I
676 Terminations -40°C~100°C TJ 676 Pin XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Kintex™-7 FPGA, 350K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a result, there are 676 terminations in total, which does really benefit system on a chip.XC7Z045 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 676 pins.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FBG676I System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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