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  6. XC7Z045-2FBG676E
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    Mfr.Part #
    XC7Z045-2FBG676E
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 800MHZ 676FCBGA
    Stock
    20,580
    In Stock ：
    20,580

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Operating Temperature :
    0°C~100°C TJ
    Speed :
    800MHz
    Moisture Sensitivity Level (MSL) :
    3 (168 Hours)
    Factory Lead Time :
    10 Weeks
    Peripherals :
    DMA
    RoHS Status :
    ROHS3 Compliant
    Number of I/O :
    130
    Package / Case :
    676-BBGA, FCBGA
    Frequency :
    800MHz
    Core Architecture :
    ARM
    Max Operating Temperature :
    100°C
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Series :
    Zynq®-7000
    Architecture :
    MCU, FPGA
    Radiation Hardening :
    No
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Packaging :
    Tray
    RAM Size :
    256KB
    Base Part Number :
    XC7Z045
    Primary Attributes :
    Kintex™-7 FPGA, 350K Logic Cells
    Data Bus Width :
    32b
    Published :
    2009
    Supplier Device Package :
    676-FCBGA (27x27)
    Min Operating Temperature :
    0°C
    Max Frequency :
    733MHz
    Speed Grade :
    -2
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Datasheets
    XC7Z045-2FBG676E
    Introducing System On Chip (SoC) AMD Xilinx XC7Z045-2FBG676E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：676-BBGA, FCBGA, Base Part Number：XC7Z045, XC7Z045-2FBG676E pinout, XC7Z045-2FBG676E datasheet PDF, XC7Z045-2FBG676E amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z045-2FBG676E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z045-2FBG676E


    0°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 350K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.In order for the SoC computing to start, 0°C is just about right.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z045-2FBG676E System On Chip (SoC) applications.


    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
    • Remote control
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