XC7Z045-1FFG900I
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- Mfr.Part #
- XC7Z045-1FFG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 900FCBGA
- Stock
- 958
- In Stock ：
- 958
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supply Voltage :
- 1V
- RAM (words) :
- 256000
- Factory Lead Time :
- 10 Weeks
- Supply Voltage-Max (Vsup) :
- 1.05V
- Memory Type :
- ROMless
- Base Part Number :
- XC7Z045
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Data Bus Width :
- 32b
- Architecture :
- MCU, FPGA
- Frequency :
- 667MHz
- Packaging :
- Tray
- Speed Grade :
- -1
- Length :
- 31mm
- Peak Reflow Temperature (Cel) :
- 245
- Radiation Hardening :
- No
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Voltage :
- 1V
- RAM Size :
- 256KB
- Operating Temperature :
- -40°C~100°C TJ
- JESD-30 Code :
- S-PBGA-B900
- Contact Plating :
- Copper, Silver, Tin
- Core Architecture :
- ARM
- Terminal Position :
- BOTTOM
- Peripherals :
- DMA
- Series :
- Zynq®-7000
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Published :
- 2009
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Form :
- Ball
- Boundary Scan :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- HTS Code :
- 8542.39.00.01
- ECCN Code :
- 3A991.D
- Package / Case :
- 900-BBGA, FCBGA
- Number of I/O :
- 130
- JESD-609 Code :
- e1
- Height Seated (Max) :
- 3.35mm
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Terminations :
- 900
- Datasheets
- XC7Z045-1FFG900I
900 Terminations -40°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 350K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.There are 900 terminations in total and that really benefits system on a chip.You can get system on chips with similar specs and purposes by searching XC7Z045.The wireless SoC works at a frequency of 667MHz.The SoC meaning is based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG900I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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