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    XC7Z045-1FFG900CES

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    Mfr.Part #
    XC7Z045-1FFG900CES
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 667MHZ 900FCBGA
    Stock
    1
    In Stock ：
    1

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    RAM Size :
    256KB
    Architecture :
    MCU, FPGA
    Core Architecture :
    ARM
    Primary Attributes :
    Kintex™-7 FPGA, 350K Logic Cells
    Max Operating Temperature :
    85°C
    Speed :
    667MHz
    Published :
    2010
    Package / Case :
    900-BBGA, FCBGA
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Min Operating Temperature :
    0°C
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Packaging :
    Tray
    Base Part Number :
    XC7Z045
    Number of I/O :
    130
    Factory Lead Time :
    7 Weeks
    Operating Temperature :
    0°C~85°C TJ
    RoHS Status :
    RoHS Compliant
    Series :
    Zynq®-7000
    Frequency :
    667MHz
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Supplier Device Package :
    900-FCBGA (31x31)
    Peripherals :
    DMA
    Introducing System On Chip (SoC) AMD Xilinx XC7Z045-1FFG900CES from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Base Part Number：XC7Z045, Operating Temperature：0°C~85°C TJ, XC7Z045-1FFG900CES pinout, XC7Z045-1FFG900CES datasheet PDF, XC7Z045-1FFG900CES amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z045-1FFG900CES ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z045-1FFG900CES


    0°C~85°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 900-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.Searching XC7Z045 will yield system on chips with similar specs and purposes.667MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.In order for the SoC computing to start up, 0°C is sufficient.There is a design maximum operating temperature of 85°C for this SoC system on chip.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z045-1FFG900CES System On Chip (SoC) applications.


    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
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