XC7Z045-1FFG676C

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Mfr.Part #
XC7Z045-1FFG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
Stock
3
In Stock :
3

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Package / Case :
676-BBGA, FCBGA
Factory Lead Time :
10 Weeks
Supply Voltage-Max (Vsup) :
1.05V
Surface Mount :
yes
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Architecture :
ARM
Base Part Number :
XC7Z045
Terminal Form :
Ball
Frequency :
667MHz
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Voltage :
1V
Architecture :
MCU, FPGA
Data Bus Width :
32b
RoHS Status :
ROHS3 Compliant
Bus Compatibility :
CAN; ETHERNET; I2C; SPI; UART; USB
ECCN Code :
3A991.D
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B676
Boundary Scan :
yes
Length :
27mm
Contact Plating :
Copper, Silver, Tin
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Published :
2009
HTS Code :
8542.39.00.01
Supply Voltage :
1V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Radiation Hardening :
No
Peripherals :
DMA
Primary Attributes :
Kintex™-7 FPGA, 350K Logic Cells
Number of Terminations :
676
JESD-609 Code :
e1
Memory Type :
ROMless
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Packaging :
Tray
RAM Size :
256KB
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
3.37mm
Number of I/O :
130
Series :
Zynq®-7000
Speed Grade :
-1
RAM (words) :
256000
Peak Reflow Temperature (Cel) :
245
Datasheets
XC7Z045-1FFG676C
Introducing System On Chip (SoC) AMD Xilinx XC7Z045-1FFG676C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Base Part Number:XC7Z045, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, XC7Z045-1FFG676C pinout, XC7Z045-1FFG676C datasheet PDF, XC7Z045-1FFG676C amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z045-1FFG676C ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z045-1FFG676C


676 Terminations 0°C~85°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines Kintex™-7 FPGA, 350K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, so system on a chip is really aided by this.A search for XC7Z045 will result in system on chips that have similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z045-1FFG676C System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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