XC7Z045-1FBG676I
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- Mfr.Part #
- XC7Z045-1FBG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 676FCBGA
- Stock
- 49
- In Stock ：
- 49
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Number of I/O :
- 130
- Peak Reflow Temperature (Cel) :
- 245
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Operating Supply Voltage :
- 1V
- Packaging :
- Tray
- Peripherals :
- DMA
- Frequency :
- 667MHz
- Series :
- Zynq®-7000
- Terminal Position :
- BOTTOM
- RAM (words) :
- 256000
- JESD-609 Code :
- e1
- Number of Terminations :
- 676
- Supply Voltage-Max (Vsup) :
- 1.05V
- Contact Plating :
- Copper, Silver, Tin
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- Published :
- 2009
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 10 Weeks
- Memory Type :
- ROMless
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Radiation Hardening :
- No
- Speed Grade :
- -1
- Core Architecture :
- ARM
- Data Bus Width :
- 32b
- ECCN Code :
- 3A991.D
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Surface Mount :
- yes
- Supply Voltage :
- 1V
- Operating Temperature :
- -40°C~100°C TJ
- Architecture :
- MCU, FPGA
- Height Seated (Max) :
- 2.54mm
- Base Part Number :
- XC7Z045
- Boundary Scan :
- yes
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Length :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 676-BBGA, FCBGA
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- RAM Size :
- 256KB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-30 Code :
- S-PBGA-B676
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Datasheets
- XC7Z045-1FBG676I
676 Terminations -40°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 676 terminations.Searching XC7Z045 will bring up system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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