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  6. XC7Z045-1FBG676CES
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    Mfr.Part #
    XC7Z045-1FBG676CES
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 667MHZ 676FCBGA
    Stock
    8,170
    In Stock ：
    8,170

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Operating Temperature :
    0°C~85°C TJ
    Terminal Form :
    Ball
    RAM (words) :
    256000
    Package / Case :
    676-BBGA, FCBGA
    RoHS Status :
    RoHS Compliant
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Architecture :
    MCU, FPGA
    Supply Voltage-Max (Vsup) :
    1.05V
    Series :
    Zynq®-7000
    Frequency :
    667MHz
    Peripherals :
    DMA
    Boundary Scan :
    yes
    Height Seated (Max) :
    2.54mm
    Packaging :
    Tray
    Number of Terminations :
    676
    Base Part Number :
    XC7Z045
    Terminal Pitch :
    1mm
    Primary Attributes :
    Kintex™-7 FPGA, 350K Logic Cells
    Number of I/O :
    130
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Published :
    2010
    RAM Size :
    256KB
    Supply Voltage-Min (Vsup) :
    0.95V
    Supply Voltage :
    1V
    Core Architecture :
    ARM
    Surface Mount :
    yes
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Width :
    27mm
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    JESD-30 Code :
    S-PBGA-B676
    Bus Compatibility :
    CAN; ETHERNET; I2C; SPI; UART; USB
    Terminal Position :
    BOTTOM
    Length :
    27mm
    Introducing System On Chip (SoC) AMD Xilinx XC7Z045-1FBG676CES from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~85°C TJ, Package / Case：676-BBGA, FCBGA, Number of Terminations：676, Base Part Number：XC7Z045, XC7Z045-1FBG676CES pinout, XC7Z045-1FBG676CES datasheet PDF, XC7Z045-1FBG676CES amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z045-1FBG676CES ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z045-1FBG676CES


    676 Terminations 0°C~85°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 350K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.95V.In total, there are 676 terminations, which is great for system on a chip.XC7Z045 will give you system on chips with similar specifications and purposes.It operates at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z045-1FBG676CES System On Chip (SoC) applications.


    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
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