XC7Z045-1FBG676C
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- Mfr.Part #
- XC7Z045-1FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 676FCBGA
- Stock
- 40,574
- In Stock ：
- 40,574
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Min Supply Voltage :
- 1.2V
- Primary Attributes :
- Kintex™-7 FPGA, 350K Logic Cells
- RoHS Status :
- ROHS3 Compliant
- Architecture :
- MCU, FPGA
- Core Architecture :
- ARM
- Number of Pins :
- 676
- Number of Terminations :
- 676
- RAM Size :
- 256KB
- Number of I/O :
- 130
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Surface Mount :
- yes
- Base Part Number :
- XC7Z045
- Factory Lead Time :
- 10 Weeks
- Frequency :
- 667MHz
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1V
- Packaging :
- Tray
- Published :
- 2009
- Number of Logic Elements/Cells :
- 190000
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Max Supply Voltage :
- 3.3V
- Series :
- Zynq®-7000
- Height Seated (Max) :
- 2.54mm
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- JESD-609 Code :
- e1
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Data Bus Width :
- 32b
- Speed Grade :
- -1
- Contact Plating :
- Copper, Silver, Tin
- HTS Code :
- 8542.39.00.01
- Peripherals :
- DMA
- Operating Temperature :
- 0°C~85°C TJ
- RAM (words) :
- 256000
- Terminal Form :
- Ball
- Length :
- 27mm
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Boundary Scan :
- yes
- Package / Case :
- 676-BBGA, FCBGA
- Radiation Hardening :
- No
- Peak Reflow Temperature (Cel) :
- 245
- Memory Type :
- ROMless
- ECCN Code :
- 3A991.D
- Datasheets
- XC7Z045-1FBG676C
676 Terminations 0°C~85°C TJ 676 Pin XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V Min 1.2V V Max 3.3V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines Kintex™-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.It is really beneficial to have system on a chip since there are 676 terminations in total.By searching XC7Z045, you can find system on chips with similar specs and purposes.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.676 pins are present on this computer SoC.Voltage of maximum supply is 3.3V.The SoC security is powered at least by 1.2V.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676C System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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