XC7Z035-L2FFG900I
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- Mfr.Part #
- XC7Z035-L2FFG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 9,234
- In Stock ：
- 9,234
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- ECCN Code :
- 3A991.D
- Operating Temperature :
- -40°C~100°C TJ
- Height Seated (Max) :
- 3.35mm
- Supply Voltage-Max (Vsup) :
- 1.05V
- JESD-30 Code :
- S-PBGA-B900
- JESD-609 Code :
- e1
- Supply Voltage :
- 1V
- Number of Terminations :
- 900
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Core Architecture :
- ARM
- Peripherals :
- DMA
- Package / Case :
- 900-BBGA, FCBGA
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code :
- 8542.39.00.01
- Boundary Scan :
- yes
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Width :
- 31mm
- Factory Lead Time :
- 10 Weeks
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Number of I/O :
- 130
- RAM Size :
- 256KB
- Terminal Form :
- Ball
- Series :
- Zynq®-7000
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Frequency :
- 800MHz
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- 245
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Supply Voltage-Min (Vsup) :
- 0.95V
- RAM (words) :
- 256000
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Architecture :
- MCU, FPGA
- Published :
- 2010
- Length :
- 31mm
- RoHS Status :
- ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Datasheets
- XC7Z035-L2FFG900I
900 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 275K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.95V, it should be able to function.system on a chip benefits from 900 terminations.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-L2FFG900I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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