XC7Z035-L2FFG676I
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- Mfr.Part #
- XC7Z035-L2FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 29,381
- In Stock ：
- 29,381
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- RoHS Status :
- ROHS3 Compliant
- Width :
- 27mm
- Surface Mount :
- yes
- Published :
- 2010
- Terminal Form :
- Ball
- RAM (words) :
- 256000
- Boundary Scan :
- yes
- Number of I/O :
- 130
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Supply Voltage-Max (Vsup) :
- 1.05V
- ECCN Code :
- 3A991.D
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage-Min (Vsup) :
- 0.95V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 10 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Length :
- 27mm
- Architecture :
- MCU, FPGA
- JESD-609 Code :
- e1
- Clock Frequency :
- 800MHz
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Package / Case :
- 676-BBGA, FCBGA
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Series :
- Zynq®-7000
- Supply Voltage :
- 1V
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max) :
- 3.37mm
- Number of Terminations :
- 676
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed :
- 800MHz
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Peripherals :
- DMA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- RAM Size :
- 256KB
- Terminal Position :
- BOTTOM
- JESD-30 Code :
- S-PBGA-B676
- Packaging :
- Tray
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Datasheets
- XC7Z035-L2FFG676I
676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 275K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.If it has at least a 0.95V volt power supply, it can work fine.In total, there are 676 terminations, so system on a chip is really aided by this.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.It operates at a clock frequency of 800MHz.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Clock Frequency: 800MHz
There are a lot of Xilinx Inc.
XC7Z035-L2FFG676I System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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