XC7Z035-3FFG900E
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- Mfr.Part #
- XC7Z035-3FFG900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 5,800
- In Stock ：
- 5,800
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supply Voltage :
- 1V
- JESD-609 Code :
- e1
- RAM Size :
- 256KB
- JESD-30 Code :
- S-PBGA-B900
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Position :
- BOTTOM
- Number of Registers :
- 343800
- Terminal Pitch :
- 1mm
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Boundary Scan :
- yes
- Speed Grade :
- 3
- Number of I/O :
- 130
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Factory Lead Time :
- 10 Weeks
- Propagation Delay :
- 90 ps
- RAM (words) :
- 256000
- Frequency :
- 800MHz
- Architecture :
- MCU, FPGA
- Min Supply Voltage :
- 950mV
- Terminal Form :
- Ball
- Core Architecture :
- ARM
- Published :
- 2010
- Contact Plating :
- Copper, Silver, Tin
- Peripherals :
- DMA
- Operating Temperature :
- 0°C~100°C TJ
- Number of Terminations :
- 900
- Series :
- Zynq®-7000
- Package / Case :
- 900-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- 245
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Max Supply Voltage :
- 1.05V
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Datasheets
- XC7Z035-3FFG900E
900 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Kintex™-7 FPGA, 275K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.It is really beneficial to have system on a chip since there are 900 terminations in total.There is 800MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.Voltage of maximum supply is 1.05V.The SoC security is powered at least by 950mV.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-3FFG900E System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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