XC7Z035-3FFG676E
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- Mfr.Part #
- XC7Z035-3FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 41,794
- In Stock ：
- 41,794
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Supply Voltage :
- 1V
- Number of I/O :
- 130
- JESD-30 Code :
- S-PBGA-B676
- Factory Lead Time :
- 10 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Operating Temperature :
- 0°C~100°C TJ
- RAM Size :
- 256KB
- Published :
- 2010
- RAM (words) :
- 256000
- JESD-609 Code :
- e1
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Frequency :
- 800MHz
- Package / Case :
- 676-BBGA, FCBGA
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- ECCN Code :
- 3A991.D
- Series :
- Zynq®-7000
- Supply Voltage-Min (Vsup) :
- 0.95V
- Terminal Position :
- BOTTOM
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals :
- DMA
- Architecture :
- MCU, FPGA
- Supply Voltage-Max (Vsup) :
- 1.05V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Pitch :
- 1mm
- Length :
- 27mm
- Core Architecture :
- ARM
- Packaging :
- Tray
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Width :
- 27mm
- Boundary Scan :
- yes
- Number of Terminations :
- 676
- Height Seated (Max) :
- 3.37mm
- Datasheets
- XC7Z035-3FFG676E
676 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Kintex™-7 FPGA, 275K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a minimum, the power supply of the SoC system on a chip needs to be 0.95V.As a result, there are 676 terminations in total, which does really benefit system on a chip.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.Moreover, this SoC processor is also equipped with additional features of PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-3FFG676E System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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