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    Mfr.Part #
    XC7Z035-3FBG676E
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 800MHZ 676FCBGA
    Stock
    40,508
    In Stock ：
    40,508

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Published :
    2010
    Package / Case :
    676-BBGA, FCBGA
    RAM (words) :
    256000
    RoHS Status :
    ROHS3 Compliant
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Primary Attributes :
    Kintex™-7 FPGA, 275K Logic Cells
    Length :
    27mm
    Number of I/O :
    130
    Peripherals :
    DMA
    Architecture :
    MCU, FPGA
    Speed Grade :
    3
    Core Architecture :
    ARM
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Propagation Delay :
    110 ps
    Terminal Form :
    Ball
    Number of Terminations :
    676
    Contact Plating :
    Copper, Silver, Tin
    JESD-609 Code :
    e1
    Packaging :
    Tray
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Series :
    Zynq®-7000
    Factory Lead Time :
    10 Weeks
    Min Supply Voltage :
    950mV
    Number of Registers :
    343800
    Moisture Sensitivity Level (MSL) :
    3 (168 Hours)
    Terminal Pitch :
    1mm
    Mount :
    Surface Mount
    Terminal Position :
    BOTTOM
    Frequency :
    800MHz
    Supply Voltage :
    1V
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    JESD-30 Code :
    S-PBGA-B676
    Max Supply Voltage :
    1.05V
    Width :
    27mm
    Height Seated (Max) :
    2.54mm
    RAM Size :
    256KB
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Boundary Scan :
    yes
    Operating Temperature :
    0°C~100°C TJ
    Bus Compatibility :
    CAN; ETHERNET; I2C; SPI; UART; USB
    Datasheets
    XC7Z035-3FBG676E
    Introducing System On Chip (SoC) AMD Xilinx XC7Z035-3FBG676E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：676-BBGA, FCBGA, Number of Terminations：676, Operating Temperature：0°C~100°C TJ, XC7Z035-3FBG676E pinout, XC7Z035-3FBG676E datasheet PDF, XC7Z035-3FBG676E amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z035-3FBG676E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z035-3FBG676E


    676 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC is built.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq®-7000.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.A 1V power supply is recommended.In total, there are 676 terminations, which makes system on a chip possible.wireless SoCs operate at 800MHz.Core architecture of ARM underpins the SoC meaning.Supply voltage is rated at 1.05V.A minimum of 950mV power is supplied to it.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z035-3FBG676E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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