XC7Z035-2FFG900I
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- Mfr.Part #
- XC7Z035-2FFG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 970
- In Stock ：
- 970
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Contact Plating :
- Copper, Silver, Tin
- Operating Temperature :
- -40°C~100°C TJ
- Number of Terminations :
- 900
- Package / Case :
- 900-BBGA, FCBGA
- Min Supply Voltage :
- 950mV
- Max Supply Voltage :
- 1.05V
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Speed Grade :
- 2
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Mount :
- Surface Mount
- Length :
- 31mm
- Number of I/O :
- 130
- Supply Voltage :
- 1V
- RoHS Status :
- ROHS3 Compliant
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Core Architecture :
- ARM
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Height Seated (Max) :
- 3.35mm
- Number of Registers :
- 343800
- Boundary Scan :
- yes
- Architecture :
- MCU, FPGA
- Frequency :
- 800MHz
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 245
- Terminal Pitch :
- 1mm
- Series :
- Zynq®-7000
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Propagation Delay :
- 100 ps
- ECCN Code :
- 3A991.D
- Width :
- 31mm
- JESD-30 Code :
- S-PBGA-B900
- RAM Size :
- 256KB
- Peripherals :
- DMA
- Published :
- 2010
- Terminal Form :
- Ball
- Factory Lead Time :
- 10 Weeks
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Datasheets
- XC7Z035-2FFG900I
900 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 275K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There are 900 terminations in total and that really benefits system on a chip.The wireless SoC works at a frequency of 800MHz.The SoC meaning is based on the core architecture of ARM.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It is rated with 1.05V maximum supply voltage.It is supplied with at least 950mV power.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG900I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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