XC7Z035-2FFG676E
- Mfr.Part #
- XC7Z035-2FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 22,263
- In Stock :
- 22,263
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Registers :
- 343800
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Max Supply Voltage :
- 1.05V
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Architecture :
- MCU, FPGA
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B676
- ECCN Code :
- 3A991.D
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~100°C TJ
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Package / Case :
- 676-BBGA, FCBGA
- Series :
- Zynq®-7000
- Number of Terminations :
- 676
- Factory Lead Time :
- 10 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Boundary Scan :
- yes
- Packaging :
- Tray
- Core Architecture :
- ARM
- Speed Grade :
- 2
- Supply Voltage :
- 1V
- Height Seated (Max) :
- 3.37mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2010
- Frequency :
- 800MHz
- Contact Plating :
- Copper, Silver, Tin
- JESD-609 Code :
- e1
- Peripherals :
- DMA
- Number of I/O :
- 130
- Mount :
- Surface Mount
- RAM Size :
- 256KB
- Propagation Delay :
- 110 ps
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Min Supply Voltage :
- 950mV
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Datasheets
- XC7Z035-2FFG676E

676 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.A system on a chip benefits from having 676 terminations.At 800MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.There is a maximum supply voltage of 1.05V.A minimum of 950mV are supplied to it.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG676E System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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