XC7Z035-2FFG676E

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Mfr.Part #
XC7Z035-2FFG676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 800MHZ 676FCBGA
Stock
22,263
In Stock :
22,263

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Registers :
343800
Additional Feature :
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Max Supply Voltage :
1.05V
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Architecture :
MCU, FPGA
Terminal Form :
Ball
JESD-30 Code :
S-PBGA-B676
ECCN Code :
3A991.D
Terminal Position :
BOTTOM
Operating Temperature :
0°C~100°C TJ
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Package / Case :
676-BBGA, FCBGA
Series :
Zynq®-7000
Number of Terminations :
676
Factory Lead Time :
10 Weeks
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Boundary Scan :
yes
Packaging :
Tray
Core Architecture :
ARM
Speed Grade :
2
Supply Voltage :
1V
Height Seated (Max) :
3.37mm
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Published :
2010
Frequency :
800MHz
Contact Plating :
Copper, Silver, Tin
JESD-609 Code :
e1
Peripherals :
DMA
Number of I/O :
130
Mount :
Surface Mount
RAM Size :
256KB
Propagation Delay :
110 ps
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
1mm
Min Supply Voltage :
950mV
Primary Attributes :
Kintex™-7 FPGA, 275K Logic Cells
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Datasheets
XC7Z035-2FFG676E
Introducing System On Chip (SoC) AMD Xilinx XC7Z035-2FFG676E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:676-BBGA, FCBGA, Number of Terminations:676, XC7Z035-2FFG676E pinout, XC7Z035-2FFG676E datasheet PDF, XC7Z035-2FFG676E amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z035-2FFG676E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z035-2FFG676E


676 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.A system on a chip benefits from having 676 terminations.At 800MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.There is a maximum supply voltage of 1.05V.A minimum of 950mV are supplied to it.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z035-2FFG676E System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
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