XC7Z035-2FBG676E
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- Mfr.Part #
- XC7Z035-2FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 24,552
- In Stock ：
- 24,552
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1V
- Peripherals :
- DMA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- RAM Size :
- 256KB
- JESD-30 Code :
- S-PBGA-B676
- Supply Voltage-Min (Vsup) :
- 0.95V
- Frequency :
- 800MHz
- Factory Lead Time :
- 10 Weeks
- Number of I/O :
- 130
- HTS Code :
- 8542.39.00.01
- Supply Voltage-Max (Vsup) :
- 1.05V
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Core Architecture :
- ARM
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Package / Case :
- 676-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Length :
- 27mm
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~100°C TJ
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Boundary Scan :
- yes
- Packaging :
- Tray
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e1
- Published :
- 2010
- Architecture :
- MCU, FPGA
- RAM (words) :
- 256000
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 676
- Width :
- 27mm
- Series :
- Zynq®-7000
- Height Seated (Max) :
- 2.54mm
- Datasheets
- XC7Z035-2FBG676E
676 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.95V.Having 676 terminations in total makes system on a chip possible.800MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.The SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY, which are additional features.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FBG676E System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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