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    Mfr.Part #
    XC7Z035-1FFG900C
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 667MHZ 900FCBGA
    Stock
    43,870
    In Stock ：
    43,870

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Speed :
    667MHz
    Number of I/O :
    130
    Core Architecture :
    ARM
    Propagation Delay :
    120 ps
    Min Supply Voltage :
    950mV
    Peripherals :
    DMA
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Operating Temperature :
    0°C~85°C TJ
    Architecture :
    MCU, FPGA
    RoHS Status :
    ROHS3 Compliant
    Factory Lead Time :
    10 Weeks
    Published :
    2010
    Packaging :
    Tray
    Min Operating Temperature :
    0°C
    Series :
    Zynq®-7000
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Max Supply Voltage :
    1.05V
    Number of Registers :
    343800
    RAM Size :
    256KB
    Max Operating Temperature :
    85°C
    Package / Case :
    900-BBGA, FCBGA
    Primary Attributes :
    Kintex™-7 FPGA, 275K Logic Cells
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Contact Plating :
    Copper, Silver, Tin
    Supplier Device Package :
    900-FCBGA (31x31)
    Frequency :
    667MHz
    Mount :
    Surface Mount
    Speed Grade :
    1
    Datasheets
    XC7Z035-1FFG900C
    Introducing System On Chip (SoC) AMD Xilinx XC7Z035-1FFG900C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~85°C TJ, Package / Case：900-BBGA, FCBGA, XC7Z035-1FFG900C pinout, XC7Z035-1FFG900C datasheet PDF, XC7Z035-1FFG900C amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z035-1FFG900C ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z035-1FFG900C


    0°C~85°C TJ System On Chip Zynq®-7000 Series 130 I/O Min 950mV V Max 1.05V V

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 900-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.667MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.In order for the SoC computing to start up, 0°C is sufficient.There is a design maximum operating temperature of 85°C for this SoC system on chip.A maximum supply voltage of 1.05V is specified for the SoC security.It is powered by at least 950mV.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z035-1FFG900C System On Chip (SoC) applications.


    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
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