XC7Z035-1FFG676I
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- Mfr.Part #
- XC7Z035-1FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 676FCBGA
- Stock
- 990
- In Stock ：
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Contact Plating :
- Copper, Silver, Tin
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Propagation Delay :
- 120 ps
- Speed Grade :
- 1
- JESD-609 Code :
- e1
- Number of I/O :
- 130
- Max Supply Voltage :
- 1.05V
- Boundary Scan :
- yes
- Mount :
- Surface Mount
- Terminal Position :
- BOTTOM
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RoHS Status :
- ROHS3 Compliant
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Series :
- Zynq®-7000
- Number of Terminations :
- 676
- RAM Size :
- 256KB
- Packaging :
- Tray
- Min Supply Voltage :
- 950mV
- Width :
- 27mm
- Published :
- 2010
- Architecture :
- MCU, FPGA
- Factory Lead Time :
- 10 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- JESD-30 Code :
- S-PBGA-B676
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max) :
- 3.37mm
- Number of Registers :
- 343800
- Supply Voltage :
- 1V
- Length :
- 27mm
- Peripherals :
- DMA
- Primary Attributes :
- Kintex™-7 FPGA, 275K Logic Cells
- Core Architecture :
- ARM
- Operating Temperature :
- -40°C~100°C TJ
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Frequency :
- 667MHz
- Package / Case :
- 676-BBGA, FCBGA
- RAM (words) :
- 256000
- Datasheets
- XC7Z035-1FFG676I
676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.The system on a chip uses 676 terminations in total.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.It has a maximum supply voltage of 1.05V rated for it.As long as it receives at least 950mV of power, then it is working.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-1FFG676I System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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