XC7Z035-1FBG676C

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Mfr.Part #
XC7Z035-1FBG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
Stock
47,141
In Stock :
47,141

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Number of Terminations :
676
Height Seated (Max) :
2.54mm
Series :
Zynq®-7000
Supply Voltage :
1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM (words) :
256000
JESD-30 Code :
S-PBGA-B676
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Tray
Package / Case :
676-BBGA, FCBGA
Terminal Position :
BOTTOM
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Max Supply Voltage :
1.05V
Frequency :
667MHz
Number of Registers :
343800
Architecture :
MCU, FPGA
JESD-609 Code :
e1
Length :
27mm
Mount :
Surface Mount
Peripherals :
DMA
Speed Grade :
1
Bus Compatibility :
CAN; ETHERNET; I2C; SPI; UART; USB
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Primary Attributes :
Kintex™-7 FPGA, 275K Logic Cells
Propagation Delay :
120 ps
Published :
2010
RAM Size :
256KB
Terminal Form :
Ball
Number of I/O :
130
RoHS Status :
ROHS3 Compliant
Operating Temperature :
0°C~85°C TJ
Core Architecture :
ARM
Min Supply Voltage :
950mV
Boundary Scan :
yes
Contact Plating :
Copper, Silver, Tin
Width :
27mm
Factory Lead Time :
10 Weeks
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Datasheets
XC7Z035-1FBG676C
Introducing System On Chip (SoC) AMD Xilinx XC7Z035-1FBG676C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Package / Case:676-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, XC7Z035-1FBG676C pinout, XC7Z035-1FBG676C datasheet PDF, XC7Z035-1FBG676C amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z035-1FBG676C ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z035-1FBG676C


676 Terminations 0°C~85°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 275K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.The system on a chip uses 676 terminations in total.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.It has a maximum supply voltage of 1.05V rated for it.As long as it receives at least 950mV of power, then it is working.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z035-1FBG676C System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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