XC7Z030-L2FFG676I
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- Mfr.Part #
- XC7Z030-L2FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 676FCBGA
- Stock
- 32,857
- In Stock ：
- 32,857
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-30 Code :
- S-PBGA-B676
- Package / Case :
- 676-BBGA, FCBGA
- Min Supply Voltage :
- 950mV
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Frequency :
- 800MHz
- Peripherals :
- DMA
- RoHS Status :
- ROHS3 Compliant
- Number of Registers :
- 157200
- Core Architecture :
- ARM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Published :
- 2010
- Terminal Pitch :
- 1mm
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Number of Terminations :
- 676
- Architecture :
- MCU, FPGA
- Packaging :
- Tray
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Number of I/O :
- 130
- Length :
- 27mm
- RAM Size :
- 256KB
- JESD-609 Code :
- e1
- Max Supply Voltage :
- 1.05V
- Series :
- Zynq®-7000
- Supply Voltage :
- 1V
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Width :
- 27mm
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 10 Weeks
- HTS Code :
- 8542.39.00.01
- Mount :
- Surface Mount
- ECCN Code :
- 3A991.D
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Form :
- Ball
- Boundary Scan :
- yes
- Height Seated (Max) :
- 3.24mm
- Contact Plating :
- Copper, Silver, Tin
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- RAM (words) :
- 256000
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Propagation Delay :
- 100 ps
- Datasheets
- XC7Z030-L2FFG676I
676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.system on a chip benefits from 676 terminations.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.Voltages up to 1.05V are specified for this SoC security.Power is provided to it at least to the extent that 950mV is required.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-L2FFG676I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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