XC7Z030-L2FBG676I

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Mfr.Part #
XC7Z030-L2FBG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 800MHZ 676FCBGA
Stock
6,574
In Stock :
6,574

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Min Supply Voltage :
950mV
Contact Plating :
Copper, Silver, Tin
Terminal Pitch :
1mm
Additional Feature :
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Length :
27mm
Package / Case :
676-BBGA, FCBGA
Packaging :
Tray
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Bus Compatibility :
CAN; ETHERNET; I2C; SPI; UART; USB
RAM Size :
256KB
Boundary Scan :
yes
Operating Temperature :
-40°C~100°C TJ
Number of Terminations :
676
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Width :
27mm
RoHS Status :
ROHS3 Compliant
RAM (words) :
256000
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Peripherals :
DMA
Number of I/O :
130
ECCN Code :
3A991.D
Max Supply Voltage :
1.05V
JESD-30 Code :
S-PBGA-B676
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supply Voltage :
1V
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Architecture :
ARM
Factory Lead Time :
10 Weeks
Number of Registers :
157200
Height Seated (Max) :
2.54mm
Mount :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Published :
2010
JESD-609 Code :
e1
Series :
Zynq®-7000
Terminal Form :
Ball
Primary Attributes :
Kintex™-7 FPGA, 125K Logic Cells
Terminal Position :
BOTTOM
Architecture :
MCU, FPGA
Frequency :
800MHz
Datasheets
XC7Z030-L2FBG676I
Introducing System On Chip (SoC) AMD Xilinx XC7Z030-L2FBG676I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Number of Terminations:676, XC7Z030-L2FBG676I pinout, XC7Z030-L2FBG676I datasheet PDF, XC7Z030-L2FBG676I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z030-L2FBG676I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z030-L2FBG676I


676 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In total, there are 676 terminations, which is great for system on a chip.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This power supply is rated with a maximum voltage of 1.05V.Power is supplied to it at least in the amount of 950mV.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z030-L2FBG676I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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