XC7Z030-3FBG676E
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- Mfr.Part #
- XC7Z030-3FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 1GHZ 676FCBGA
- Stock
- 26,910
- In Stock ：
- 26,910
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Terminal Form :
- Ball
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Speed Grade :
- -3
- Core Architecture :
- ARM
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Frequency :
- 1GHz
- Number of Terminations :
- 676
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- HTS Code :
- 8542.39.00.01
- Contact Plating :
- Copper, Silver, Tin
- Terminal Position :
- BOTTOM
- Series :
- Zynq®-7000
- Base Part Number :
- XC7Z030
- Height Seated (Max) :
- 2.54mm
- Length :
- 27mm
- JESD-609 Code :
- e1
- RAM Size :
- 256KB
- Surface Mount :
- yes
- Data Bus Width :
- 32b
- Radiation Hardening :
- No
- Architecture :
- MCU, FPGA
- Supply Voltage-Max (Vsup) :
- 1.05V
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Packaging :
- Tray
- Boundary Scan :
- yes
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 10 Weeks
- Peripherals :
- DMA
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Operating Temperature :
- 0°C~100°C TJ
- Package / Case :
- 676-BBGA, FCBGA
- Supply Voltage :
- 1V
- ECCN Code :
- 3A991.D
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- 245
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 130
- RAM (words) :
- 256000
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of Pins :
- 676
- Operating Supply Voltage :
- 1V
- Published :
- 2009
- Datasheets
- XC7Z030-3FBG676E
676 Terminations 0°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC is built.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq®-7000.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.A 1V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.In total, there are 676 terminations, which makes system on a chip possible.Search XC7Z030 for system on chips with similar specs and purposes.wireless SoCs operate at 1GHz.Core architecture of ARM underpins the SoC meaning.There is a 676-pin version of this computer SoC available.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-3FBG676E System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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