XC7Z030-2SBG485I
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- Mfr.Part #
- XC7Z030-2SBG485I
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-FBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 485FCBGA
- Stock
- 980
- In Stock ：
- 980
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Factory Lead Time :
- 10 Weeks
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Number of Pins :
- 485
- UV Erasable :
- N
- Published :
- 2009
- Operating Temperature :
- -40°C~100°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Power Supplies :
- 11.8V
- RAM Size :
- 256KB
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Frequency :
- 800MHz
- Contact Plating :
- Copper, Silver, Tin
- Peripherals :
- DMA
- Packaging :
- Tray
- Supply Voltage-Max (Vsup) :
- 1.05V
- Package / Case :
- 484-FBGA, FCBGA
- Supply Voltage-Min (Vsup) :
- 0.95V
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- EAR99
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RAM (words) :
- 256000
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Boundary Scan :
- yes
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Qualification Status :
- Not Qualified
- Number of I/O :
- 130
- Height Seated (Max) :
- 2.44mm
- Series :
- Zynq®-7000
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Form :
- Ball
- Supply Voltage :
- 1V
- JESD-609 Code :
- e1
- Terminal Pitch :
- 0.8mm
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Number of Terminations :
- 485
- Core Architecture :
- ARM
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Architecture :
- MCU, FPGA
- Mount :
- Surface Mount
- Data Bus Width :
- 32b
- Length :
- 19mm
- Datasheets
- XC7Z030-2SBG485I
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485 Terminations -40°C~100°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-FBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 125K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.It can feed on a power supply of at least 0.95V.There are 485 terminations in total and that really benefits system on a chip.System on chip requires 11.8V power supplies.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.The wireless SoC works at a frequency of 800MHz.The SoC meaning is based on the core architecture of ARM.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This is the 485-pin version of the computer SoC.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-2SBG485I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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