XC7Z030-2SBG485E
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- Mfr.Part #
- XC7Z030-2SBG485E
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-FBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 485FCBGA
- Stock
- 26,429
- In Stock ：
- 26,429
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2009
- Operating Temperature :
- 0°C~100°C TJ
- ECCN Code :
- EAR99
- Number of Pins :
- 485
- Data Bus Width :
- 32b
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Core Architecture :
- ARM
- Supply Voltage-Max (Vsup) :
- 1.05V
- Contact Plating :
- Copper, Silver, Tin
- Peripherals :
- DMA
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- Power Supplies :
- 11.8V
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Supply Voltage-Min (Vsup) :
- 0.95V
- JESD-609 Code :
- e1
- Supply Voltage :
- 1V
- Series :
- Zynq®-7000
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Package / Case :
- 484-FBGA, FCBGA
- Factory Lead Time :
- 10 Weeks
- Architecture :
- MCU, FPGA
- Mount :
- Surface Mount
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Number of Terminations :
- 485
- Terminal Pitch :
- 0.8mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- UV Erasable :
- N
- RAM (words) :
- 256000
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of I/O :
- 130
- Frequency :
- 800MHz
- Terminal Form :
- Ball
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Boundary Scan :
- yes
- Length :
- 19mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- RAM Size :
- 256KB
- Height Seated (Max) :
- 2.44mm
- Datasheets
- XC7Z030-2SBG485E
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485 Terminations 0°C~100°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 484-FBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.95V.In total, there are 485 terminations, which is great for system on a chip.A power supply of 11.8V is required to run system on chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC has 485 pins.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-2SBG485E System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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