XC7Z030-2FFG676I

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Mfr.Part #
XC7Z030-2FFG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 800MHZ 676FCBGA
Stock
495
In Stock :
495

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Series :
Zynq®-7000
Frequency :
800MHz
Architecture :
MCU, FPGA
Terminal Form :
Ball
Number of Pins :
676
Factory Lead Time :
10 Weeks
Packaging :
Tray
Core Architecture :
ARM
Pbfree Code :
yes
Contact Plating :
Copper, Silver, Tin
Pin Count :
676
RAM (words) :
256000
UV Erasable :
N
Primary Attributes :
Kintex™-7 FPGA, 125K Logic Cells
RAM Size :
256KB
HTS Code :
8542.39.00.01
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RoHS Status :
ROHS3 Compliant
Boundary Scan :
yes
Package / Case :
676-BBGA, FCBGA
Radiation Hardening :
No
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Power Supplies :
11.8V
Terminal Position :
BOTTOM
Data Bus Width :
32b
Supply Voltage-Max (Vsup) :
1.05V
Number of Terminations :
676
Number of I/O :
130
Peripherals :
DMA
Operating Supply Voltage :
1V
ECCN Code :
3A991.D
Height Seated (Max) :
3.24mm
Length :
27mm
Supply Voltage :
1V
Base Part Number :
XC7Z030
Bus Compatibility :
CAN; ETHERNET; I2C; SPI; UART; USB
Surface Mount :
yes
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e1
Peak Reflow Temperature (Cel) :
245
Operating Temperature :
-40°C~100°C TJ
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed Grade :
-2
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Published :
2009
Datasheets
XC7Z030-2FFG676I
Introducing System On Chip (SoC) AMD Xilinx XC7Z030-2FFG676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:676, Package / Case:676-BBGA, FCBGA, Number of Terminations:676, Base Part Number:XC7Z030, Operating Temperature:-40°C~100°C TJ, XC7Z030-2FFG676I pinout, XC7Z030-2FFG676I datasheet PDF, XC7Z030-2FFG676I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z030-2FFG676I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z030-2FFG676I


676 Terminations -40°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.Having 676 terminations in total makes system on a chip possible.You will need to provide 11.8V power supplies in order to run system on chip.Searching XC7Z030 will yield system on chips with similar specs and purposes.800MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Currently, the computer SoC is available in a 676-pin version.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z030-2FFG676I System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
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