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    Mfr.Part #
    XC7Z030-2FF676I
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 800MHZ 676FCBGA
    Stock
    4,382
    In Stock ：
    4,382

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    RAM Size :
    256KB
    Packaging :
    Tray
    Core Architecture :
    ARM
    Terminal Position :
    BOTTOM
    Architecture :
    MCU, FPGA
    Base Part Number :
    XC7Z030
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Terminal Form :
    Ball
    Peripherals :
    DMA
    Factory Lead Time :
    11 Weeks
    RAM (words) :
    256000
    Operating Temperature :
    -40°C~100°C TJ
    Number of I/O :
    130
    Series :
    Zynq®-7000
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Published :
    2009
    Data Bus Width :
    32b
    HTS Code :
    8542.39.00.01
    Package / Case :
    676-BBGA, FCBGA
    JESD-30 Code :
    S-PBGA-B676
    Boundary Scan :
    yes
    Bus Compatibility :
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
    Surface Mount :
    yes
    RoHS Status :
    Non-RoHS Compliant
    Number of Terminations :
    676
    Frequency :
    800MHz
    Primary Attributes :
    Kintex™-7 FPGA, 125K Logic Cells
    Datasheets
    XC7Z030-2FF676I
    Introducing System On Chip (SoC) AMD Xilinx XC7Z030-2FF676I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number：XC7Z030, Operating Temperature：-40°C~100°C TJ, Package / Case：676-BBGA, FCBGA, Number of Terminations：676, XC7Z030-2FF676I pinout, XC7Z030-2FF676I datasheet PDF, XC7Z030-2FF676I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z030-2FF676I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z030-2FF676I


    676 Terminations -40°C~100°C TJ XC7Z030 System On Chip Zynq®-7000 Series 130 I/O

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC is built.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq®-7000.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.In total, there are 676 terminations, which makes system on a chip possible.Search XC7Z030 for system on chips with similar specs and purposes.wireless SoCs operate at 800MHz.Core architecture of ARM underpins the SoC meaning.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z030-2FF676I System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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