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    Mfr.Part #
    XC7Z030-2FB484I
    Manufacturer
    AMD Xilinx
    Package / Case
    484-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A9 800MHZ 484FCBGA
    Stock
    26,332
    In Stock ：
    26,332

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    RoHS Status :
    ROHS3 Compliant
    Number of I/O :
    130
    Frequency :
    800MHz
    Architecture :
    MCU, FPGA
    HTS Code :
    8542.39.00.01
    JESD-30 Code :
    S-PBGA-B484
    Terminal Position :
    BOTTOM
    Boundary Scan :
    yes
    Interface :
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    Terminal Form :
    Ball
    Series :
    Zynq®-7000
    Radiation Hardening :
    No
    Primary Attributes :
    Kintex™-7 FPGA, 125K Logic Cells
    Data Bus Width :
    32b
    Core Processor :
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Pbfree Code :
    No
    Surface Mount :
    yes
    RAM Size :
    256KB
    Core Architecture :
    ARM
    Bus Compatibility :
    CAN, ETHERNET, I2C, PCI, SPI, UART, USB
    Peripherals :
    DMA
    Factory Lead Time :
    11 Weeks
    Number of Terminations :
    484
    Package / Case :
    484-BBGA, FCBGA
    RAM (words) :
    256000
    Moisture Sensitivity Level (MSL) :
    3 (168 Hours)
    Operating Temperature :
    -40°C~100°C TJ
    Packaging :
    Tray
    Published :
    2009
    Datasheets
    XC7Z030-2FB484I
    Introducing System On Chip (SoC) AMD Xilinx XC7Z030-2FB484I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations：484, Package / Case：484-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XC7Z030-2FB484I pinout, XC7Z030-2FB484I datasheet PDF, XC7Z030-2FB484I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z030-2FB484I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7Z030-2FB484I


    484 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O

    This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 484-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Kintex™-7 FPGA, 125K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.As a result, there are 484 terminations in total, which does really benefit system on a chip.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    Core Architecture: ARM


    There are a lot of Xilinx Inc.


    XC7Z030-2FB484I System On Chip (SoC) applications.


    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
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