XC7Z030-1SBG485C
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- Mfr.Part #
- XC7Z030-1SBG485C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-FBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 485FCBGA
- Stock
- 10,307
- In Stock ：
- 10,307
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Terminal Pitch :
- 0.8mm
- Height Seated (Max) :
- 2.44mm
- Terminal Position :
- BOTTOM
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Surface Mount :
- yes
- Number of I/O :
- 130
- Peripherals :
- DMA
- Speed Grade :
- -1
- Terminal Form :
- Ball
- Number of Terminations :
- 485
- Supply Voltage :
- 1V
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Supply Voltage-Min (Vsup) :
- 0.95V
- Boundary Scan :
- yes
- Factory Lead Time :
- 10 Weeks
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- RAM (words) :
- 256000
- Published :
- 2009
- RAM Size :
- 256KB
- Package / Case :
- 484-FBGA, FCBGA
- Qualification Status :
- Not Qualified
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- JESD-609 Code :
- e1
- UV Erasable :
- N
- Core Architecture :
- ARM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 1.05V
- Packaging :
- Tray
- Data Bus Width :
- 32b
- HTS Code :
- 8542.39.00.01
- Architecture :
- MCU, FPGA
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- ECCN Code :
- EAR99
- Frequency :
- 667MHz
- Series :
- Zynq®-7000
- Length :
- 19mm
- Power Supplies :
- 11.8V
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 485
- Contact Plating :
- Copper, Silver, Tin
- Datasheets
- XC7Z030-1SBG485C
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485 Terminations 0°C~85°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 484-FBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.95V, it should be able to function.system on a chip benefits from 485 terminations.There is 11.8V power supply requirement for this system on chip SoC.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.During operation, the wireless SoC runs at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 485.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1SBG485C System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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