XC7Z030-1FFG676I

Manufacturer :

AMD Xilinx

Product Category :

System On Chip (SoC)

Terminal Form :

Ball

Boundary Scan :

yes

Radiation Hardening :

No

Supply Voltage :

1V

RAM (words) :

256000

Interface :

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Architecture :

MCU, FPGA

Length :

27mm

Terminal Position :

BOTTOM

Frequency :

667MHz

Number of Pins :

676

Bus Compatibility :

CAN; ETHERNET; I2C; SPI; UART; USB

Time@Peak Reflow Temperature-Max (s) :

30

Number of I/O :

130

Package / Case :

676-BBGA, FCBGA

Operating Supply Voltage :

1V

Core Processor :

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Series :

Zynq®-7000

Base Part Number :

XC7Z030

UV Erasable :

N

Moisture Sensitivity Level (MSL) :

4 (72 Hours)

Surface Mount :

yes

Pbfree Code :

yes

Peak Reflow Temperature (Cel) :

245

Connectivity :

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Pin Count :

676

Speed Grade :

-1

Operating Temperature :

-40°C~100°C TJ

Packaging :

Tray

RAM Size :

256KB

HTS Code :

8542.39.00.01

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

3.24mm

Core Architecture :

ARM

Factory Lead Time :

10 Weeks

Data Bus Width :

32b

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Primary Attributes :

Kintex™-7 FPGA, 125K Logic Cells

Supply Voltage-Max (Vsup) :

1.05V

Contact Plating :

Copper, Silver, Tin

Peripherals :

DMA

Published :

2009

Terminal Pitch :

1mm

JESD-609 Code :

e1

Power Supplies :

11.8V

Number of Terminations :

676

ECCN Code :

3A991.D