XC7Z030-1FFG676C
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- Mfr.Part #
- XC7Z030-1FFG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 676FCBGA
- Stock
- 14,624
- In Stock ：
- 14,624
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- RAM Size :
- 256KB
- Published :
- 2009
- Base Part Number :
- XC7Z030
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1V
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 10 Weeks
- RAM (words) :
- 256000
- Length :
- 27mm
- Core Architecture :
- ARM
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Height Seated (Max) :
- 3.24mm
- Series :
- Zynq®-7000
- Speed Grade :
- -1
- Number of Terminations :
- 676
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Packaging :
- Tray
- ECCN Code :
- 3A991.D
- Contact Plating :
- Copper, Silver, Tin
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Position :
- BOTTOM
- Number of Pins :
- 676
- Operating Temperature :
- 0°C~85°C TJ
- Operating Supply Voltage :
- 1V
- Peripherals :
- DMA
- Number of I/O :
- 130
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Frequency :
- 667MHz
- Package / Case :
- 676-BBGA, FCBGA
- Boundary Scan :
- yes
- Data Bus Width :
- 32b
- Peak Reflow Temperature (Cel) :
- 245
- Surface Mount :
- yes
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture :
- MCU, FPGA
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Terminal Form :
- Ball
- JESD-609 Code :
- e1
- Supply Voltage-Max (Vsup) :
- 1.05V
- Radiation Hardening :
- No
- Datasheets
- XC7Z030-1FFG676C
676 Terminations 0°C~85°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq®-7000 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.Having 676 terminations in total makes system on a chip possible.Searching XC7Z030 will yield system on chips with similar specs and purposes.667MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Currently, the computer SoC is available in a 676-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FFG676C System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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