XC7Z030-1FBG676C
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- Mfr.Part #
- XC7Z030-1FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Frequency :
- 667MHz
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peripherals :
- DMA
- Terminal Pitch :
- 1mm
- Package / Case :
- 676-BBGA, FCBGA
- RAM (words) :
- 256000
- Number of Pins :
- 676
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1V
- Number of I/O :
- 130
- Base Part Number :
- XC7Z030
- ECCN Code :
- 3A991.D
- Supply Voltage-Max (Vsup) :
- 1.05V
- Terminal Position :
- BOTTOM
- RAM Size :
- 256KB
- Surface Mount :
- yes
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Packaging :
- Tray
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- JESD-609 Code :
- e1
- Core Architecture :
- ARM
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- 245
- Contact Plating :
- Copper, Silver, Tin
- Operating Temperature :
- 0°C~85°C TJ
- Radiation Hardening :
- No
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 1V
- Published :
- 2009
- Height Seated (Max) :
- 2.54mm
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Data Bus Width :
- 32b
- Speed Grade :
- -1
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Terminations :
- 676
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Series :
- Zynq®-7000
- Boundary Scan :
- yes
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Architecture :
- MCU, FPGA
- Factory Lead Time :
- 10 Weeks
- Length :
- 27mm
- Datasheets
- XC7Z030-1FBG676C
676 Terminations 0°C~85°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines Kintex™-7 FPGA, 125K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a result, there are 676 terminations in total, which does really benefit system on a chip.XC7Z030 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 667MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 676 pins.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676C System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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