XC7Z030-1FBG484C
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- Mfr.Part #
- XC7Z030-1FBG484C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 484FCBGA
- Stock
- 35,762
- In Stock ：
- 35,762
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Surface Mount :
- yes
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 484-BBGA, FCBGA
- Number of Terminations :
- 484
- Published :
- 2009
- Data Bus Width :
- 32b
- Peak Reflow Temperature (Cel) :
- 250
- Supply Voltage-Max (Vsup) :
- 1.05V
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 130
- Supply Voltage :
- 1V
- Contact Plating :
- Copper, Silver, Tin
- Architecture :
- MCU, FPGA
- RoHS Status :
- ROHS3 Compliant
- Series :
- Zynq®-7000
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Radiation Hardening :
- No
- RAM Size :
- 256KB
- Primary Attributes :
- Kintex™-7 FPGA, 125K Logic Cells
- Base Part Number :
- XC7Z030
- Boundary Scan :
- yes
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Pitch :
- 1mm
- Operating Supply Voltage :
- 1V
- Terminal Position :
- BOTTOM
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Length :
- 23mm
- Core Architecture :
- ARM
- Number of Pins :
- 484
- Terminal Form :
- Ball
- Frequency :
- 667MHz
- ECCN Code :
- EAR99
- Height Seated (Max) :
- 2.54mm
- RAM (words) :
- 256000
- Peripherals :
- DMA
- JESD-609 Code :
- e1
- Speed Grade :
- -1
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- XC7Z030-1FBG484C
484 Terminations 0°C~85°C TJ 484 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 484 terminations.Searching XC7Z030 will bring up system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG484C System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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