XC7Z020-3CLG484E
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- Mfr.Part #
- XC7Z020-3CLG484E
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 866MHZ 484BGA
- Stock
- 33,593
- In Stock ：
- 33,593
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Number of Terminations :
- 484
- Package / Case :
- 484-LFBGA, CSPBGA
- Surface Mount :
- yes
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- ECCN Code :
- 3A991.D
- Factory Lead Time :
- 10 Weeks
- Peripherals :
- DMA
- Terminal Form :
- Ball
- Base Part Number :
- XC7Z020
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage-Max (Vsup) :
- 1.05V
- Operating Supply Voltage :
- 1V
- Terminal Position :
- BOTTOM
- Published :
- 2009
- JESD-609 Code :
- e1
- Length :
- 19mm
- Architecture :
- MCU, FPGA
- Number of Pins :
- 484
- Primary Attributes :
- Artix™-7 FPGA, 85K Logic Cells
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Core Architecture :
- ARM
- Supply Voltage :
- 1V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Speed Grade :
- -3
- Operating Temperature :
- 0°C~100°C TJ
- RAM (words) :
- 256000
- Terminal Pitch :
- 0.8mm
- Series :
- Zynq®-7000
- Boundary Scan :
- yes
- Frequency :
- 866MHz
- Data Bus Width :
- 32b
- RAM Size :
- 256KB
- Number of I/O :
- 130
- Time@Peak Reflow Temperature-Max (s) :
- 30
- HTS Code :
- 8542.39.00.01
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Contact Plating :
- Copper, Silver, Tin
- Height Seated (Max) :
- 1.6mm
- Radiation Hardening :
- No
- Datasheets
- XC7Z020-3CLG484E
484 Terminations 0°C~100°C TJ 484 Pin XC7Z020 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 484-LFBGA, CSPBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Artix™-7 FPGA, 85K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.It is really beneficial to have system on a chip since there are 484 terminations in total.By searching XC7Z020, you can find system on chips with similar specs and purposes.There is 866MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.484 pins are present on this computer SoC.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-3CLG484E System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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