XC7Z015-2CLG485E
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- Mfr.Part #
- XC7Z015-2CLG485E
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 766MHZ 485CSBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Supply Voltage :
- 1V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 130
- Primary Attributes :
- Artix™-7 FPGA, 74K Logic Cells
- JESD-609 Code :
- e1
- Number of Pins :
- 485
- Number of Terminations :
- 485
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- 0°C~100°C TJ
- RoHS Status :
- ROHS3 Compliant
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- HTS Code :
- 8542.39.00.01
- RAM (words) :
- 256000
- Data Bus Width :
- 32b
- Frequency :
- 766MHz
- Packaging :
- Tray
- Height Seated (Max) :
- 1.6mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Series :
- Zynq®-7000
- UV Erasable :
- N
- Package / Case :
- 484-LFBGA, CSPBGA
- Published :
- 2010
- RAM Size :
- 256KB
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Qualification Status :
- Not Qualified
- Architecture :
- MCU, FPGA
- ECCN Code :
- EAR99
- Factory Lead Time :
- 10 Weeks
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Supply Voltage-Max (Vsup) :
- 1.05V
- Power Supplies :
- 11.8V
- Contact Plating :
- Copper, Silver, Tin
- Core Architecture :
- ARM
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Supply Voltage-Min (Vsup) :
- 0.95V
- Peripherals :
- DMA
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Terminal Pitch :
- 0.8mm
- Boundary Scan :
- yes
- Length :
- 19mm
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Datasheets
- XC7Z015-2CLG485E
485 Terminations 0°C~100°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-LFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Artix™-7 FPGA, 74K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.Power supplies of at least 0.95V are required.A system on a chip benefits from having 485 terminations.In order to operate system on chip, you will need 11.8V power supplies.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.At 766MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC is the 485-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z015-2CLG485E System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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