XC7Z015-1CLG485C
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- Mfr.Part #
- XC7Z015-1CLG485C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 485CSBGA
- Stock
- 490
- In Stock ：
- 490
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Package / Case :
- 484-LFBGA, CSPBGA
- Peripherals :
- DMA
- RAM Size :
- 256KB
- Boundary Scan :
- yes
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TJ
- Architecture :
- MCU, FPGA
- Surface Mount :
- yes
- Contact Plating :
- Copper, Silver, Tin
- Terminal Pitch :
- 0.8mm
- Series :
- Zynq®-7000
- Frequency :
- 667MHz
- JESD-609 Code :
- e1
- ECCN Code :
- EAR99
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage :
- 1V
- UV Erasable :
- N
- Published :
- 2010
- Factory Lead Time :
- 10 Weeks
- Supply Voltage-Min (Vsup) :
- 0.95V
- Primary Attributes :
- Artix™-7 FPGA, 74K Logic Cells
- Core Architecture :
- ARM
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Number of Terminations :
- 485
- Number of Pins :
- 485
- Data Bus Width :
- 32b
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Qualification Status :
- Not Qualified
- Speed Grade :
- 1
- Packaging :
- Tray
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O :
- 130
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RAM (words) :
- 256000
- Datasheets
- XC7Z015-1CLG485C
485 Terminations 0°C~85°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 484-LFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Artix™-7 FPGA, 74K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.As long as it receives a power supply that is at least 0.95V, it should be able to function.system on a chip benefits from 485 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.During operation, the wireless SoC runs at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 485.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z015-1CLG485C System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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