XC7Z010-L1CLG225I
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- Mfr.Part #
- XC7Z010-L1CLG225I
- Manufacturer
- AMD Xilinx
- Package / Case
- 225-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 225BGA
- Stock
- 42,488
- In Stock ：
- 42,488
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Package / Case :
- 225-LFBGA, CSPBGA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Height Seated (Max) :
- 1.5mm
- Supply Voltage-Max (Vsup) :
- 1.05V
- Operating Supply Voltage :
- 1V
- Boundary Scan :
- yes
- Peak Reflow Temperature (Cel) :
- 260
- JESD-609 Code :
- e1
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Primary Attributes :
- Artix™-7 FPGA, 28K Logic Cells
- Architecture :
- MCU, FPGA
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- RAM Size :
- 256KB
- Number of I/O :
- 86
- Number of Terminations :
- 225
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- HTS Code :
- 8542.39.00.01
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Contact Plating :
- Copper, Silver, Tin
- ECCN Code :
- EAR99
- Supply Voltage :
- 1V
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Terminal Pitch :
- 0.8mm
- Length :
- 13mm
- Operating Temperature :
- -40°C~100°C TJ
- RAM (words) :
- 256000
- Core Architecture :
- ARM
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 10 Weeks
- Published :
- 2010
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B225
- Data Bus Width :
- 32b
- Peripherals :
- DMA
- Series :
- Zynq®-7000
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Mount :
- Surface Mount
- Frequency :
- 667MHz
- Datasheets
- XC7Z010-L1CLG225I
225 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 86 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 225-LFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Artix™-7 FPGA, 28K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 86 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 225 terminations.During operation, the wireless SoC runs at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z010-L1CLG225I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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