XC7Z010-3CLG400E
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- Mfr.Part #
- XC7Z010-3CLG400E
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 866MHZ 400BGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Primary Attributes :
- Artix™-7 FPGA, 28K Logic Cells
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Data Bus Width :
- 32b
- JESD-609 Code :
- e1
- Number of Pins :
- 400
- Published :
- 2010
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- Speed Grade :
- -3
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- ECCN Code :
- EAR99
- Boundary Scan :
- yes
- Series :
- Zynq®-7000
- Length :
- 17mm
- Package / Case :
- 400-LFBGA, CSPBGA
- Base Part Number :
- XC7Z010
- Surface Mount :
- yes
- Frequency :
- 866MHz
- Radiation Hardening :
- No
- Supply Voltage-Max (Vsup) :
- 1.05V
- Terminal Pitch :
- 0.8mm
- Height Seated (Max) :
- 1.6mm
- Peripherals :
- DMA
- Terminal Form :
- Ball
- Number of Terminations :
- 400
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Operating Temperature :
- 0°C~100°C TJ
- Terminal Position :
- BOTTOM
- Contact Plating :
- Copper, Silver, Tin
- Number of I/O :
- 130
- RAM (words) :
- 256000
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage :
- 1V
- Operating Supply Voltage :
- 1V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Core Architecture :
- ARM
- RAM Size :
- 256KB
- Architecture :
- MCU, FPGA
- Datasheets
- XC7Z010-3CLG400E
400 Terminations 0°C~100°C TJ 400 Pin XC7Z010 System On Chip Zynq®-7000 Series 130 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 400-LFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Artix™-7 FPGA, 28K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.A system on a chip benefits from having 400 terminations.Searching XC7Z010 will bring up system on chips with similar specs and purposes.At 866MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 400-pin version.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-3CLG400E System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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