XC7S75-2FGGA676I

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Mfr.Part #
XC7S75-2FGGA676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FPBGA
Stock
990
In Stock :
990

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Number of I/O :
400
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of LABs/CLBs :
6000
Voltage - Supply :
0.95V~1.05V
Terminal Position :
BOTTOM
Operating Temperature :
-40°C~100°C TJ
Supply Voltage :
1V
Surface Mount :
yes
Mounting Type :
Surface Mount
Total RAM Bits :
4331520
Series :
Spartan®-7
HTS Code :
8542.39.00.01
Package / Case :
676-BGA
Number of Logic Elements/Cells :
76800
Number of Terminations :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
10 Weeks
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B676
Packaging :
Tray
Combinatorial Delay of a CLB-Max :
1.05 ns
Datasheets
XC7S75-2FGGA676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-2FGGA676I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:676-BGA, Number of Terminations:676, XC7S75-2FGGA676I pinout, XC7S75-2FGGA676I datasheet PDF, XC7S75-2FGGA676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S75-2FGGA676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7S75-2FGGA676I


FPGAs AMD Xilinx XC7S75-2FGGA676I Overview

The FPGAs AMD Xilinx XC7S75-2FGGA676I is a high-performance, field-programmable gate array designed for applications requiring a high level of processing power and I/O versatility. Engineered by AMD Xilinx, this FPGA is part of the robust 7 series, tailored to deliver exceptional performance in terms of both speed and capacity. The XC7S75-2FGGA676I is encapsulated in a 676-pin flip-chip BGA package and supports a wide range of digital and mixed-signal applications. This product is an ideal solution for designers looking to leverage the advanced capabilities of FPGAs to accelerate their system development and achieve greater system integration.

XC7S75-2FGGA676I Features

This integrated circuit features 400 I/O pins which provide ample flexibility for diverse hardware interfaces. Additionally, the XC7S75-2FGGA676I offers a substantial logic density, enabling it to handle complex algorithms and multiple functionalities. Its robust architecture allows for scalable designs, which is essential for future-proofing technology solutions. The device also features advanced security protocols, ensuring safe and reliable operation in sensitive applications.

XC7S75-2FGGA676I Applications

  • Telecommunications Equipment: Utilizes its high I/O count and processing capability to manage data flows and signal processing, enhancing the performance and reliability of telecommunications infrastructure.
  • Automotive Driver Assistance Systems (ADAS): Employs its robust processing power to interpret sensor data and support real-time decision-making, contributing to safer driving technologies.
  • Industrial Automation: Adapts its versatile I/O and substantial logic resources to control and monitor automated processes, increasing efficiency and reducing operational costs in industrial settings.
  • Consumer Electronics: Supports advanced user interfaces and multimedia processing requirements, enabling richer user experiences in devices like smart TVs and gaming consoles.
  • Medical Imaging Systems: Leverages its ability to process large volumes of data to assist in complex image processing tasks, crucial for accurate and timely medical diagnostics.
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