XC7S100-L1FGGA676I
- Mfr.Part #
- XC7S100-L1FGGA676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FPBGA
- Stock
- 1,258
- In Stock :
- 1,258
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Spartan®-7
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 102400
- Terminal Position :
- BOTTOM
- Number of I/O :
- 400
- Number of Terminations :
- 676
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 1.27 ns
- Packaging :
- Tray
- Supply Voltage :
- 0.95V
- Voltage - Supply :
- 0.92V~0.98V
- Operating Temperature :
- -40°C~100°C TJ
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 4423680
- JESD-30 Code :
- S-PBGA-B676
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 676-BGA
- RoHS Status :
- ROHS3 Compliant
- Number of LABs/CLBs :
- 8000
- Factory Lead Time :
- 10 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- Datasheets
- XC7S100-L1FGGA676I

FPGAs AMD Xilinx XC7S100-L1FGGA676I Overview
The AMD Xilinx XC7S100-L1FGGA676I, a cutting-edge Field Programmable Gate Array (FPGA), offers remarkable flexibility and performance for sophisticated electronics applications. This FPGA is engineered to meet the rigorous demands of modern digital circuits, providing a robust 676-pin FBGA (Fine-Pitch Ball Grid Array) package and a substantial array of 400 I/Os. Designed to accelerate product development cycles and enhance system performance, this component is an ideal choice for developers looking for high-speed, reliable programmable logic solutions. The inclusion of advanced security features and power efficiency makes the XC7S100-L1FGGA676I an indispensable part of any high-performance hardware design.
XC7S100-L1FGGA676I Features
This FPGA is designed for high efficiency and performance, featuring a comprehensive set of capabilities. It supports a wide range of digital and mixed-signal applications with its extensive I/O options and high-speed data processing capabilities. The device is also characterized by its enhanced security features, which protect against potential threats and ensure reliable operation in critical applications. Moreover, its low power consumption and advanced thermal management technologies contribute to a sustainable, cost-effective solution for complex electronic designs.
XC7S100-L1FGGA676I Applications
- Data Centers: Utilized in server infrastructure to manage vast data flows and optimize network operations, enhancing processing capabilities and energy efficiency.
- Telecommunications: Deployed in communication infrastructure to facilitate high-speed data transmission and signal processing, improving bandwidth and system reliability.
- Automotive: Integrated into driver assistance systems to process real-time data from sensors and cameras, increasing vehicular safety and functionality.
- Industrial Automation: Employed in control systems to enhance operational efficiency and precision in manufacturing processes, reducing downtime and increasing output.
- Aerospace and Defense: Used in navigation and control systems for aircraft and unmanned vehicles, offering robust performance in harsh environments and critical situations.
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