XC7S100-1FGGA676Q

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Mfr.Part #
XC7S100-1FGGA676Q
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FBGA
Stock
46,823
In Stock :
46,823

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
4423680
Terminal Form :
Ball
Number of Logic Elements/Cells :
102400
Number of I/O :
400
Factory Lead Time :
10 Weeks
Number of Terminations :
676
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B676
Operating Temperature :
-40°C~125°C TJ
Terminal Pitch :
1mm
Terminal Position :
BOTTOM
Height Seated (Max) :
2.44mm
Width :
27mm
Mounting Type :
Surface Mount
Length :
27mm
JESD-609 Code :
e3
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
0.95V~1.05V
Series :
Spartan®-7
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
676-BGA
Combinatorial Delay of a CLB-Max :
1.27 ns
Number of LABs/CLBs :
8000
Terminal Finish :
Matte Tin (Sn)
Supply Voltage :
1V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
HTS Code :
8542.39.00.01
Datasheets
XC7S100-1FGGA676Q
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S100-1FGGA676Q from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Operating Temperature:-40°C~125°C TJ, Mounting Type:Surface Mount, Package / Case:676-BGA, XC7S100-1FGGA676Q pinout, XC7S100-1FGGA676Q datasheet PDF, XC7S100-1FGGA676Q amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7S100-1FGGA676Q ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7S100-1FGGA676Q


FPGAs AMD Xilinx XC7S100-1FGGA676Q Overview

The FPGAs AMD Xilinx XC7S100-1FGGA676Q is a high-performance Field Programmable Gate Array (FPGA) designed to meet the intensive requirements of modern digital circuits. Engineered by AMD Xilinx, this IC is a powerful solution for applications requiring rapid prototyping and flexible hardware configuration. The XC7S100-1FGGA676Q features a robust design encapsulated in a 676-pin FBGA package, providing extensive I/O capabilities with 400 available pins for diverse application needs. This makes it an ideal choice for developers looking to push the boundaries of hardware acceleration and system integration.

XC7S100-1FGGA676Q Features

The XC7S100-1FGGA676Q FPGA boasts a range of features that enhance its functionality and usability in complex electronics environments. These include a high density of logic cells, support for advanced digital signal processing, high-speed serial connectivity, and the capability to be reprogrammed in the field to adapt to new system requirements. These characteristics make the XC7S100-1FGGA676Q highly adaptable and scalable, suitable for both prototyping and full-scale deployment.

XC7S100-1FGGA676Q Applications

  • Telecommunications Equipment: Utilized in routers and switches for packet processing and traffic management, enhancing bandwidth and reducing latency.
  • Automotive Systems: Applied in driver assistance systems to process real-time sensor data, improving vehicle safety and performance.
  • Data Centers: Used in server farms for accelerating complex algorithms like machine learning inference, significantly boosting processing power and efficiency.
  • Consumer Electronics: Integrated into smart home devices to manage multiple inputs and outputs, providing flexibility and higher control to end-users.
  • Industrial Automation: Employed in control systems for real-time operations monitoring and automation tasks, increasing reliability and productivity in harsh environments.
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