XC7S75-2FGGA484I
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- Mfr.Part #
- XC7S75-2FGGA484I
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BGA
- Datasheet
- Download
- Description
- IC FPGA 338 I/O 484FBGA
- Stock
- 970
- In Stock ：
- 970
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 4331520
- Combinatorial Delay of a CLB-Max :
- 1.05 ns
- Number of Terminations :
- 484
- Series :
- Spartan®-7
- Package / Case :
- 484-BGA
- JESD-30 Code :
- S-PBGA-B484
- RAM Size :
- 405kB
- Number of Logic Elements/Cells :
- 76800
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 6000
- Surface Mount :
- yes
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 338
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 0.95V~1.05V
- Factory Lead Time :
- 10 Weeks
- Supply Voltage :
- 1V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XC7S75-2FGGA484I
FPGAs AMD Xilinx XC7S75-2FGGA484I Overview
The FPGAs AMD Xilinx XC7S75-2FGGA484I is a high-performance, field-programmable gate array that offers a robust solution for a variety of complex digital circuits and system level designs. Engineered by AMD Xilinx, this FPGA stands out with its extensive I/O capabilities housed within a compact 484-ball fine-pitch BGA package. Ideal for demanding applications, the XC7S75-2FGGA484I provides a flexible and scalable architecture that supports a wide range of uses from consumer electronics to industrial applications, ensuring efficient and reliable performance tailored to specific design requirements.
XC7S75-2FGGA484I Features
The XC7S75-2FGGA484I FPGA includes several key features that make it a versatile choice for designers:
- High I/O Count: Equipped with 338 I/Os, it supports complex and multi-faceted designs requiring numerous inputs and outputs.
- Advanced BGA Packaging: Utilizes a 484-pin fine-pitch BGA package, optimizing board space and improving signal integrity.
- Low Power Consumption: Designed to operate efficiently with AMD Xilinx's power management technology, reducing overall power costs in large-scale deployments.
- Programmable Logic: Offers robust programmable logic capabilities for tailored solutions across various applications.
XC7S75-2FGGA484I Applications
- Consumer Electronics: Can be integrated into smart home devices and entertainment systems, enhancing user interface and connectivity capabilities.
- Automotive Systems: Suitable for use in automotive applications, such as advanced driver-assistance systems (ADAS), where high-speed data processing and reliability are crucial.
- Industrial Automation: Applies to complex industrial automation systems, facilitating improved process control and machine-to-machine communication.
- Data Processing: Ideal for data centers requiring FPGA capabilities for handling large volumes of data with low latency.
- Telecommunications: Enhances telecommunications infrastructure, supporting increased data throughput and network reliability in routers and switches.
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